Nuvo-5000LP

6개의 GbE, MezIO 인터페이스 & 저사양 섀시를 갖춘 인텔 6세대 코어 i7/i5/i3 팬리스 견고한 임베디드 컴퓨터

  • Intel® 6th Gen Core™ i7/i5/i3 35W/65W socket-type CPU
  • MezIO™ interface for easy function expansion
  • Rugged, -25°C to 70°C fanless operation
  • Up to 6x GigE ports, supporting 9.5 KB jumbo frame
  • Up to 32 GB, DDR4-2133 SODIMM
  • One hot-swappable 2.5” HDD/SSD and one fixed 2.5” HDD/SSD, supporting RAID 0/1
  • Accommodates two 2.5″ SATA HDD/SSD with RAID 0/1
  • VGA/DVI/DP triple independent display, supporting 4K2K
  • 77 mm low-profile design

Overview

Introduction

Nuvo-5002LP/5006LP는 Nuvo-5000 계열의 저사양 버젼입니다. 저사양 섀시로 높이가 77mm로 낮아지고, 25°C ~ 70°C의 작동 온도를 유지합니다. 다양한 컴퓨팅 성능을 원하는 사용자를 위해, Nuvo-5002LP/5006LP는 유연한 CPU 설치를 위한 소켓형 CPU를 지원합니다. 성능 고려 사항 및 운영 환경에 따라 인텔 6세대 코어 i7/i5/i3를 35W부터 65W TDP까지 선택할 수 있습니다.

Nuvo-5002LP/5006LP는 Nuvo-5000E/P로부터 Gbe, USB3/USB2, COM 및 VGA/DVI/DP와 같은 종합적인 I/O 기능을 물려받은 팬리스 임베디드 컴퓨터입니다. 또한 추가 I/O 확장을 위해서 MezIO 인터페이스를 통합했습니다. 선택적으로 MezIO 모듈을 설치하므로써 Nuvo-5002LP/5006LP는 11개의 COM 포트, 32개의 DIO 채널, 점화 전원 컨트롤 또는 사용자 정의된 애플리케이션 I/O를 포함하여 일반적인 내장형 컨트롤러에서 견고한 애플리케이션 플랫폼으로 즉시 전환됩니다.

Nuvo-5002LP/5006LP is the low-profile version of Nuvo-5000 family. It features a low-profile chassis, which reduces its height to 77 mm, and remains extraordinary 25°C to 70°C operating temperature. For those demanding varied computing power, Nuvo-5002LP/5006LP supports socket-type CPU for flexible CPU installation. You can choose Intel® 6th Gen Core™ i7/i5/i3, from 35W to 65W TDP, according to your performance consideration and operating environment.

Nuvo-5002LP/5006LP fanless embedded computer inherits comprehensive I/O functions, such as GbE, USB3/USB2, COM and VGA/DVI/DP, from Nuvo-5000E/P. It also incorporates Neousys’ MezIO™ interface for further I/O expansion. By installing optional MezIO™ module, Nuvo-5002LP/5006LP turns immediately from a typical embedded controller to a ruggedized application platform including 11x COM ports, 32 DIO channels, ignition power control, or your customized application-specific I/O.

Specification

System Core
Processor Core™ i7-6700 (8M Cache, 3.4/4.0 GHz, 65W TDP)*
Core™ i5-6500 (6M Cache, 3.2/3.6 GHz, 65W TDP)*
Core™ i3-6100 (3M Cache, 3.7 GHz, 51W TDP)*
Pentium® G4400 (3M Cache, 2.4 GHz, 54W TDP)*
Celeron® G3900 (2M Cache, 2.8 GHz, 51TDP)*
Core™ i7-6700TE (8M Cache, 2.4/3.4 GHz, 35W TDP)
Core™ i5-6500TE (6M Cache, 2.3/3.3 GHz, 35W TDP)
Core™ i3-6100TE (4M Cache, 2.7 GHz, 35W TDP)
Pentium® G4400TE (3M Cache, 2.4 GHz, 35W TDP)
Celeron® G3900TE (2M Cache, 2.3 GHz, 35W TDP)
Chipset Intel® Q170 Platform Controller Hub
Graphics Integrated Intel® HD Graphics 530 (Core™ i7/i5/i3)
Integrated Intel® HD Graphics 510 (Pentium®)
Memory Up to 32 GB DDR4-2133 SDRAM by two SODIMM sockets
AMT Supports Intel® AMT 11
TPM Supports TPM 2.0
Front-panel I/O Interface
Ethernet 2x Gigabit Ethernet ports by Intel® I219 and I210
(Nuvo-5002E/P)
6x Gigabit Ethernet ports by Intel® I219 and 5x I210
(Nuvo-5006E/P)
PoE+ Optional IEEE 802.3at PoE+ PSE for GbE Port 3 ~ Port 6, 80 W
total power budget
USB 4x USB 3.0 ports via native XHCI controller
4x USB 2.0 ports
Video Port 1x stacked VGA + DVI-D connector
2x DisplayPort connectors, supporting 4K2K resolution
Serial Port 2x software-programmable RS-232/422/485 port
(COM1 & COM2)
1x RS-232 port (COM3)
Audio 1x Mic-in and 1x Speaker-out
Storage Interface
SATA Interface 1x hot-swappable tray for 2.5″ HDD/SSD installation
1x Internal SATA port for 2.5″ HDD/SSD installation, supporting RAID 0/1
mSATA 1x full-size mSATA port (mux with mini-PCIe)
Expansion Bus
Mini PCI-E 1x mini PCI-E socket with front-accessible SIM socket
1x mini PCI-E socket with internal SIM socket
(mux with mSATA)
Expandable I/O 1x MezIO™ expansion port for Neousys MezIO™ modules
Power Supply
DC Input 1x 3-pin pluggable terminal block for 8~35VDC DC input
Remote Ctrl. &
Status Output
1x 10-pin (2×5) wafer connector for
remote on/off control and status LED output
Mechanical
Dimension 240 mm (W) x 225 mm (D) x 77 mm (H)
Weight 3.1 Kg (including 2.5″ HDD and DDR4 SODIMM)
Mounting Wall-mounting (standard) or DIN-Rail mounting (optional)
Environmental
Operating Temperature with i7-6700TE, i5-6500TE, i3-6100TE, Pentium G4400TE (35W TDP)
-25°C ~ 70°C **
with i7-6700, i5-6500, i3-6100 (65W/51W TDP)
-25°C ~ 70°C */** (configured as 35W mode)
-25°C ~ 50°C */** (configured as 65W/51W mode)
Storage Temperature -40°C ~ 85°C
Humidity 10%~90% , non-condensing
Vibration Operating, 5 Grms, 5-500 Hz, 3 Axes
(w/ SSD, according to IEC60068-2-64)
Shock Operating, 50 Grms, Half-sine 11 ms Duration
(w/ SSD, according to IEC60068-2-27)
EMC CE/FCC Class A, according to EN 55022 & EN 55024
EN 50155:2007

* The 100% CPU loading is applied using Passmark® BurnInTest 8.1. For detail testing criteria, please contact Neousys Technology.
**For sub-zero operating temperature, a wide temperature HDD drive or Solid State Disk (SSD) is required