Intel® 6th-Gen Skylake Core™ i7/i5/i3 팬리스 임베디드 컴퓨터, GbE 포트 6개, MezIO™ 인터페이스, 슬림형 Low-Profile 구조

Nuvo-5000LP 산업용 팬리스 임베디드 PC

Intel® 6th Gen Core™ i7/i5/i3 35W/65W socket-type CPU
MezIO™ interface for easy function expansion
Rugged, -25°C to 70°C fanless operation
Up to 6x GigE ports, supporting 9.5 KB jumbo frame
Up to 32 GB, DDR4-2133 SODIMM
One hot-swappable 2.5” HDD/SSD and one fixed 2.5” HDD/SSD, supporting RAID 0/1
Accommodates two 2.5″ SATA HDD/SSD with RAID 0/1
VGA/DVI/DP triple independent display, supporting 4K2K
77 mm low-profile design

Overview

Introduction

Nuvo-5002LP/5006LP는 Nuvo-5000 패밀리의 슬림형 Low-Profile 버전입니다. 높이를 77 mm로 낮춘 Low-Profile 섀시를 사용하며, -25°C~70°C라는 놀라운 작동 온도를 유지합니다. 다양한 컴퓨팅 파워에 대한 요구에 맞춰, Nuvo-5002LP/5006LP는 유연한 설치를 위한 소켓 타입 CPU를 지원합니다. 성능과 작동 환경을 고려해 Intel® 6th Gen Core™ i7/i5/i3를 35W에서 65W TDP까지 선택할 수 있습니다.

Nuvo-5002LP/5006LP 팬리스 임베디드 컴퓨터는 GbE, USB3/USB2, COM, VGA/DVI/DP 등의 포괄적인 I/O 기능을 Nuvo-5000E/P로부터 이어받았습니다. 또한 Neousys의 MezIO™ 인터페이스를 탑재해 더 많은 I/O 확장성을 제공합니다.

Nuvo-5002LP/5006LP는 즉시 보통의 임베디드 컨트롤러에서 COM 포트 11개, 32채널 DIO, 차량 점화 전원 컨트롤, 또는 커스터마이징한 애플리케이션 전용 I/O를 갖춘 러기드 애플리케이션 플랫폼으로 변신합니다.

Nuvo-5002LP/5006LP is the low-profile version of Nuvo-5000 family. It features a low-profile chassis, which reduces its height to 77 mm, and remains extraordinary 25°C to 70°C operating temperature. For those demanding varied computing power, Nuvo-5002LP/5006LP supports socket-type CPU for flexible CPU installation. You can choose Intel® 6th Gen Core™ i7/i5/i3, from 35W to 65W TDP, according to your performance consideration and operating environment.

Nuvo-5002LP/5006LP fanless embedded computer inherits comprehensive I/O functions, such as GbE, USB3/USB2, COM and VGA/DVI/DP, from Nuvo-5000E/P. It also incorporates Neousys’ MezIO™ interface for further I/O expansion. By installing optional MezIO™ module, Nuvo-5002LP/5006LP turns immediately from a typical embedded controller to a ruggedized application platform including 11x COM ports, 32 DIO channels, ignition power control, or your customized application-specific I/O.

Specifications

System Core
Processor	Core™ i7-6700 (8M Cache, 3.4/4.0 GHz, 65W TDP)* Core™ i5-6500 (6M Cache, 3.2/3.6 GHz, 65W TDP)* Core™ i3-6100 (3M Cache, 3.7 GHz, 51W TDP)* Pentium® G4400 (3M Cache, 2.4 GHz, 54W TDP)* Celeron® G3900 (2M Cache, 2.8 GHz, 51TDP)* Core™ i7-6700TE (8M Cache, 2.4/3.4 GHz, 35W TDP) Core™ i5-6500TE (6M Cache, 2.3/3.3 GHz, 35W TDP) Core™ i3-6100TE (4M Cache, 2.7 GHz, 35W TDP) Pentium® G4400TE (3M Cache, 2.4 GHz, 35W TDP) Celeron® G3900TE (2M Cache, 2.3 GHz, 35W TDP)
Chipset	Intel® Q170 Platform Controller Hub
Graphics	Integrated Intel® HD Graphics 530 (Core™ i7/i5/i3) Integrated Intel® HD Graphics 510 (Pentium®)
Memory	Up to 32 GB DDR4-2133 SDRAM by two SODIMM sockets
AMT	Supports Intel® AMT 11
TPM	Supports TPM 2.0

Front-panel I/O Interface
Ethernet	2x Gigabit Ethernet ports by Intel® I219 and I210 (Nuvo-5002E/P) 6x Gigabit Ethernet ports by Intel® I219 and 5x I210 (Nuvo-5006E/P)
PoE+	Optional IEEE 802.3at PoE+ PSE for GbE Port 3 ~ Port 6, 80 W total power budget
USB	4x USB 3.0 ports via native XHCI controller 4x USB 2.0 ports
Video Port	1x stacked VGA + DVI-D connector 2x DisplayPort connectors, supporting 4K2K resolution
Serial Port	2x software-programmable RS-232/422/485 port (COM1 & COM2) 1x RS-232 port (COM3)
Audio	1x Mic-in and 1x Speaker-out

Storage Interface
SATA Interface	1x hot-swappable tray for 2.5″ HDD/SSD installation 1x Internal SATA port for 2.5″ HDD/SSD installation, supporting RAID 0/1
mSATA	1x full-size mSATA port (mux with mini-PCIe)

Expansion Bus
Mini PCI-E	1x mini PCI-E socket with front-accessible SIM socket 1x mini PCI-E socket with internal SIM socket (mux with mSATA)
Expandable I/O	1x MezIO™ expansion port for Neousys MezIO™ modules

Power Supply
DC Input	1x 3-pin pluggable terminal block for 8~35VDC DC input
Remote Ctrl. & Status Output	1x 10-pin (2×5) wafer connector for remote on/off control and status LED output

Mechanical
Dimension	240 mm (W) x 225 mm (D) x 77 mm (H)
Weight	3.1 Kg (including 2.5″ HDD and DDR4 SODIMM)
Mounting	Wall-mounting (standard) or DIN-Rail mounting (optional)

Environmental
Operating Temperature	with i7-6700TE, i5-6500TE, i3-6100TE, Pentium G4400TE (35W TDP) -25°C ~ 70°C ** with i7-6700, i5-6500, i3-6100 (65W/51W TDP) -25°C ~ 70°C /* (configured as 35W mode) -25°C ~ 50°C /* (configured as 65W/51W mode)
Storage Temperature	-40°C ~ 85°C
Humidity	10%~90% , non-condensing
Vibration	Operating, 5 Grms, 5-500 Hz, 3 Axes (w/ SSD, according to IEC60068-2-64)
Shock	Operating, 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27)
EMC	CE/FCC Class A, according to EN 55022 & EN 55024 EN 50155:2007

* The 100% CPU loading is applied using Passmark® BurnInTest 8.1. For detail testing criteria, please contact Neousys Technology.
**For sub-zero operating temperature, a wide temperature HDD drive or Solid State Disk (SSD) is required

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